The selection and design of surface mount components is a key part of the overall design of the product. The designer determines the electrical performance and function of the components in the system structure and detailed circuit design stages. In the SMT design stage, it should be based on the specific conditions and overall Design requirements determine the packaging form and structure of surface mount components. Surface-mounted solder joints are both mechanical and electrical connections. Reasonable selection will have a decisive impact on improving PCB design density, manufacturability, testability, and reliability.
There is no difference in function between surface mount components and plug-in components, the difference lies in the packaging of components. Surface mount packages must have matching thermal expansion coefficients for components and substrates that are to withstand high temperatures when soldered. These factors must be considered holistically in product design.
The main advantages of choosing a suitable package are:
1) Effectively save PCB area;
2) Provide better electrical performance;
3) Protect the interior of components from moisture and other environmental influences;
4) Provide good communication links;
5) Help heat dissipation and provide convenience for transmission and testing.